Download Area Array Packaging Handbook: Manufacturing and Assembly by Ken Gilleo PDF
By Ken Gilleo
It presents a good and useful available quickly connection with the undefined. intensity of the content material can be correct for advertising and administration those that desire a few wisdom of the sector. The publication is even though, too basic for digital Engineer. nevertheless, the photographs within aren't in solid solution. besides, if you want a good reference, it prevent at the least numerous days or even weeks time in looking net to your asked details.
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Extra info for Area Array Packaging Handbook: Manufacturing and Assembly
First, these metals oxidize, and the oxidation must be removed for soldering, making the chip pad even thinner. The soldering process dissolves some of the substrate so that the thin copper or aluminum is dissolved, or leached away. In the case of aluminum, solderability is difficult at best even if the aluminum is thick. Something must be added to the pads. The package must make the chip pads compatible by adding additional conductive material, and adding more metal does this. However, the metal can be a coating, bumps, or wires, and this determines the basic connection class (covered later).
1 Hermetic The hermetic package is a gas-tight container that does not require an encapsulating material. The hermetic package is not a common class for area array packaging and may be viewed as a specialty type for very high reliability or unusual systems. 2 Molding Compounds Molding compounds have represented the preferred means of package protection for several decades. The most common materials are epoxy molding compounds (EMCs). EMCs consist of solid epoxy resins, solid hardeners, fillers, and additives.
The common package is hard, strong, and easy to grip. The simple design allows easy recognition by visual inspection and by machine vision. The lead layout and package shape permit easy orientation. An SOT-23 transistor package, for example, has two leads on one side and a single lead on the opposite side. Not only can a pick-and-place robot easily confirm the orientation, but simple mechanical feeders also can orient this nonsymmetric package so that all are presented correctly. Packaging and machine-building associations have worked together to maximize compatibility between package style and machine, and this leads to the next subsection.