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By Shinskey F.G.
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Sample text
The individual layers are printed with thick-film paste to create the metalization patterns, aligned with the other layers, and are laminated at elevated temperature and pressure. Resistors and capacitors, compatible with the green tape process, may also be fabricated. The feature size depends on the thick film process, which has a typical conductor line width of 200 µm down to 100 µm. low-temperature cofired ceramic (LTCC) MCMs are a good choice for low-loss and good thermal conductivity [25, 26].
3(b) highlights one of the most basic and simple approaches. , C4 solder or gold stud bumps. 3(b). Here the antenna is part of the main PCB. The main benefits are extremely low cost, ease of assembly and readiness for high-volume manufacturing. The challenges in this approach are matching TCE with acceptable materials, PCB losses in the C4 or stud bump and the Transmission line (T-line) losses to get to the antenna, PCB induced T-line resolution and tolerances, and net radiation efficiency of the antenna.
20 or more. Individual substrates are clamped into the package, which simplifies the assembly and disassembly process. The local substrate ground is contacted to the overall package ground via the substrates’ gold-plated backside metalization. 12: CNC-milled mmWave package used in R&S network analyzers for frequencies up to 24 GHz. Reproduced by permission of © 2008 Rohde & Schwarz. electrically ‘stealthy’ clickable plastic bars, apply pressure to the substrate where needed, for instance, at the transfer points of a microstrip line.